[PDF.09mh] Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology

Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology

[PDF.dx64] Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology

Chemical-Mechanical Polishing of Low  Christopher Lyle Borst, William N. Gill, Ronald J. Gutmann epub
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 | #6094822 in Books |  CRC Press |  2002-09-30 | Original language:English | PDF # 1 |  9.21 x.69 x6.14l,1.18 | File type: PDF | 229 pages

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||1 of 1 people found the following review helpful.| Good textbook on the subject|By Newton Ooi|This book gives a solid, easy to read introduction to CMP and all the different factors associated with it. The text is accessible to any undergraduate in engineering, yet contains a lot of information that makes it handy as a reference.

As semiconductor manufacturers implement copper conductors in advanced interconnect schemes, research and development efforts shift toward the selection of an insulator that can take maximum advantage of the lower power and faster signal propagation allowed by copper interconnects. One of the main challenges to integrating a low-dielectric constant (low-kappa) insulator as a replacement for silicon dioxide is the behavior of such materials during the chemical-mechanic...

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